SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF

摘要

Electrodes (4) formed on the surface of a first resin sealed package (11) sealing a semiconductor chip (3) are connected to the electrodes (15) of the semiconductor chip (3). Each electrode (4) comprises a mounting area (101) connected to a substrate, carrier tape or other resin package on which the first resin package is mounted. Each electrode (4) also has a testing area (102) connected to the mounting area. The testing area is connectable to testing equipment. Therefore, the chip (3) can be tested without the test probe damaging the surface of the mounting area (101). The resin also seals the chip from the surrounding environment. Fig 5.