| 摘要 |
An element storage package (1) is provided with a substrate (3) having a mounting area (R) for an element (2) on the top surface thereof, and a base body (4) which is formed along the outer circumference of the mounting area (R) on the substrate (3) and which has a portion having an attachment portion (C). Further, the element storage package (1) is provided with an insulation body (5) having a line conductor (11) which is provided in the attachment portion (C) and which has an upper portion that extends from an area overlapped with the base body (4) to an area that is not overlapped with the base body (4) in a planar view and establishes an electric continuity between the inside and the outside of the base body (4); and a frame body (6) which is connected to the upper portion of the insulation body (5) and which is overlapped with the base body (4) in a planar view. Further, the element storage package (1) is provided with an adhesive body (7) which is provided within an area surrounded by the frame body (6) in a planar view and which is formed from the inner wall surface of the frame body (6) to the upper portion of the insulation body (5). |
