发明名称 |
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF ASSEMBLING SAME, AND SYSTEMS CONTAINING SAME |
摘要 |
A stacked-chip apparatus includes a package substrate and an interposer with a chip stack disposed with a standoff that matches the interposer. A package-on-package stacked-chip apparatus includes a top package disposed on the interposer. |
申请公布号 |
WO2010151375(A1) |
申请公布日期 |
2010.12.29 |
申请号 |
WO2010US33536 |
申请日期 |
2010.05.04 |
申请人 |
INTEL CORPORATION;MUTHUKUMAR, SRIRAM;GEALER, CHARLES A. |
发明人 |
MUTHUKUMAR, SRIRAM;GEALER, CHARLES A. |
分类号 |
H01L23/12;H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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