Electromagnetic bandgap pattern structure, method of manufacturing the same, and security product using the same
摘要
<p>Disclosed herein is an electromagnetic bandgap (EBG) pattern structure, including: a nonconductive substrate; and a pattern assembly formed on the substrate and including regularly arranged closed-loop patterns and open-loop patterns both of which are made of a conductive material. The EBG pattern structure is advantageous in that it can be used to manufacture new security products by applying its frequency characteristics to securities or IDs and in that it can be variously used in security technologies for preventing forgery and alteration because various security codes can be created by adjusting the variables of its EBG pattern.</p>
申请公布号
EP2267843(A1)
申请公布日期
2010.12.29
申请号
EP20100163374
申请日期
2010.05.20
申请人
KOREA MINTING, SECURITY PRINTING & ID CARD OPERATING CORP.
发明人
YU, JONG WON;LIM, WON GYU;JANG, HYEONG SEOK;SHIN, DONG HOON;RYU, JIN HO;KIM, HYUN MI;CHOE, WON GYUN