发明名称 CURABLE RESIN COMPOSITION
摘要 <p>A curable resin composition which has basic properties for a sealing material such as weather resistance and adhesiveness and is capable of maintaining low possibility of contamination for a long time from the initial stage of use, without having surface tackiness after curing.  The curable resin composition contains 100 parts by mass of a (meth)acrylic polymer (A) having at least one crosslinkable silyl group at an end, 0.1-100 parts by mass of a diamine compound (B) having an optionally branched monovalent or divalent aliphatic or alicyclic hydrocarbon group having 8 or more carbon atoms and at least one primary amino group, and 0.1-100 parts by mass of a diamine compound (C) having an optionally branched monovalent aliphatic or alicyclic hydrocarbon group having 8 or more carbon atoms and a crosslinkable silyl group and/or a (meth)acryloyl group.</p>
申请公布号 WO2010150361(A1) 申请公布日期 2010.12.29
申请号 WO2009JP61451 申请日期 2009.06.24
申请人 KANEKA CORPORATION;KOTANI, JUN;KOBAYASHI, NOBUYUKI;HOSODA, HIROYUKI;ISHIKAWA, KAZUNORI 发明人 KOTANI, JUN;KOBAYASHI, NOBUYUKI;HOSODA, HIROYUKI;ISHIKAWA, KAZUNORI
分类号 C08L33/14 主分类号 C08L33/14
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