Resin molded optical semiconductor device and corresponding fabrication method

摘要

In fabrication of a semiconductor device (105) mounted on a wiring board, a semiconductor circuit portion is formed over a glass substrate (201). Then, an interposer (101) having connection terminals are bonded to the semiconductor circuit portion (105). After that, the glass substrate (201) is peeled off from the semiconductor circuit portion (105), and a mold resin (102) is poured to cover the periphery of the semiconductor circuit portion from a direction of the separation plane. Then, the mold resin (102) is heated under predetermined conditions to be hardened.