| 摘要 |
As a replacement for high-temperature solder having a solidus temperature of at least 250° C. for bonding a package and a lid of a functional part, a solder paste formed by mixing a Cu-based metal powder with a solidus temperature of at least 400° C. and an Sn-based solder powder is applied to a lid of a difficult to solder material which was previously subjected to plating having good solderability and heated to obtain a solder layer comprising the Cu-based metal powder, Cu6Sn5 intermetallic compounds, and lead-free solder on the plated surface. The intermetallic compounds are bonded to the difficult to solder material and the intermetallic compounds are connected to each other, so the solder layer functions as a high-temperature solder. The problem of poor solderability of high-temperature solders is avoided by the present invention. |
