发明名称 Elongate through holes for electronic device case to mitigate against electrostatic discharge
摘要 Electronic components within a device having a case 10 or housing 10 that has through-holes 11 (11a-c) which mitigate against external electrostatic discharge (ESD) 200 by ensuring that the length and shape of the through-hole 11 is equal to or greater in length than the length of a possible electric arc produced as a result of a possible electrostatic discharge. Thus such a through-hole corresponding in position to an electronic component 12 and communicating with the outside will help prevent electric arcs from reaching the electronic component. The holes may have one step 11 or many (fig 3b) or may be slanted (fig 2) or curved (fig 3a).
申请公布号 GB2471346(A) 申请公布日期 2010.12.29
申请号 GB20090015911 申请日期 2009.09.11
申请人 ASKEY COMPUTER CORP 发明人 JYUAN-DA LIN;CHING-FENG HSIEH
分类号 H05K9/00 主分类号 H05K9/00
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