发明名称 |
Pad area and method of fabricating the same |
摘要 |
A pad area and a method of fabricating the same, wherein the pad area is formed on a substrate to contact a chip on glass (COG) or a chip on flexible printed circuit (COF) with the substrate. Changing a lower structure of the pad area increases contact points between conductive balls and an interconnection layer or reduces a step difference between an interconnection layer and a passivation layer to enhance and ensure electrical connection.
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申请公布号 |
US7859604(B2) |
申请公布日期 |
2010.12.28 |
申请号 |
US20060540543 |
申请日期 |
2006.10.02 |
申请人 |
SAMSUNG MOBILE DISPLAY CO., LTD. |
发明人 |
JEONG CHANG-YONG;KANG TAE-WOOK;KWAK WON-KYU |
分类号 |
G02F1/136 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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