发明名称 |
Cooling facility for cooling a component |
摘要 |
A heat sink for cooling a component is disclosed. A medium flows around the heat sink by at least sectional guidance of a main flow and a secondary flow of the medium, the main flow being separated from the secondary flow up to a constriction. After the constriction the secondary flow merges with the main flow.
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申请公布号 |
US7859842(B2) |
申请公布日期 |
2010.12.28 |
申请号 |
US20090381289 |
申请日期 |
2009.03.10 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BUSCH KLAUS;SCHARF CHRISTIAN;WIESNER CHRISTOPH |
分类号 |
H05K7/20;G06F1/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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