发明名称 Cooling facility for cooling a component
摘要 A heat sink for cooling a component is disclosed. A medium flows around the heat sink by at least sectional guidance of a main flow and a secondary flow of the medium, the main flow being separated from the secondary flow up to a constriction. After the constriction the secondary flow merges with the main flow.
申请公布号 US7859842(B2) 申请公布日期 2010.12.28
申请号 US20090381289 申请日期 2009.03.10
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BUSCH KLAUS;SCHARF CHRISTIAN;WIESNER CHRISTOPH
分类号 H05K7/20;G06F1/20 主分类号 H05K7/20
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