PURPOSE: The heat dissipation LED package a lot multiplies the peel strength between the heat sink and substrate. The phenomenon that it is twisted by the top of the substrate and the heat dissipation LED package is mounted or the phenomenon that the adhesive material to one side leans is up blocked. CONSTITUTION: The package body(14) partly has light-transmissive. The LED(12) is built in the package body. In the heat sink is the floor side of the package body the heat from LED, it emits to outside. The heat sink is attached with the adhesive material to substrate.
