发明名称 |
Solid-state imaging device, its production method, camera with the solid-state imaging device, and light receiving chip |
摘要 |
Provided is a light-receiving chip whose transparent protection plate has an area equal to or smaller than an area of the light-receiving chip, and which does not require a base portion for mounting. Provision of the light-receiving chip contributes to reduction in size and weight of cameras. In addition, provision of a solid-state imaging apparatus having excellent productivity contributes to reduction in price of cameras. A solid-state imaging apparatus (10) having: a solid-state imaging device (11) (a light-receiving chip) provided with a plurality of light-receiving cells arranged either one dimensionally or two dimensionally on one main surface of a base substrate; and a transparent protection plate (12) provided to cover a light-receiving area (18) (the plurality of light-receiving cells), where an area of the transparent protection plate is equal to or smaller than an area of the light-receiving chip, and a space (20) is formed between the light-receiving cells and the transparent protection plate.
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申请公布号 |
US7859586(B2) |
申请公布日期 |
2010.12.28 |
申请号 |
US20040583095 |
申请日期 |
2004.12.17 |
申请人 |
PANASONIC CORPORATION |
发明人 |
MURATA TAKAHIKO;KASUGA SHIGETAKA;YAMAGUTI TAKUMI |
分类号 |
H04N5/225;G02B13/16;H01L23/02;H01L27/14;H01L27/146;H01L31/02;H01L31/0203 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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