| 摘要 |
A process for performing non-destructive monitoring of a semiconductor device that permits detection of additional circuitry that is not part of the original, intended design. This permits verification that additional circuitry, for example malicious circuitry, has not been added to the semiconductor device. In one embodiment, the monitoring is performed at the die level before the die is packaged into a complete semiconductor device. The monitoring is non-destructive so that the semiconductor die is not destroyed during the monitoring process.
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