发明名称 |
Spring adapted to hold electronic device in a frame |
摘要 |
An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.
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申请公布号 |
US7859847(B2) |
申请公布日期 |
2010.12.28 |
申请号 |
US20040027337 |
申请日期 |
2004.12.29 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
BARSUN STEPHAN KARL |
分类号 |
H05K7/20;F28F7/00;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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