发明名称 Bi-directional semiconductor ESD protection device
摘要 A semiconductor substrate has a second conductivity type cathode layer formed thereon. The cathode layer has a first conductivity type base layer formed thereon. A first anode region of the second conductivity type is formed in the surface of the base layer. A second anode region of the first conductivity type is formed in the first anode region. A first semiconductor region of the first conductivity type is formed in contact with the semiconductor substrate. A second semiconductor region of the second conductivity type is formed adjacent to the first semiconductor region and in contact with the cathode layer. An intermediate electrode is formed on the surfaces of the first semiconductor region and the contact region.
申请公布号 US7859010(B2) 申请公布日期 2010.12.28
申请号 US20080014449 申请日期 2008.01.15
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 INOUE TOMOKI
分类号 H01L29/861 主分类号 H01L29/861
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