| 摘要 |
To provide a semiconductor module and a semiconductor device enabling more accurate testing of the connection state of the internal wiring between the semiconductor devices. The semiconductor device has switches SW11 through SW13 that connect a test terminal TT to one end side of wires to be tested, and transistors M21 through M23 that supply a ground potential VSS to the other end side of the wires to be tested. When a power source potential VDD is supplied to one end of the wires to be tested and a ground potential VSS is supplied to the other end of the wires to be tested, a current path can be formed including the wires to be tested. If a power source potential VDD is supplied to the wires to be tested and a ground potential VSS is supplied to the wires which are not to be tested, a difference in potential can be generated between the wires to be tested and the rest of the wires, which makes it possible to detect a short circuit failure.
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