| 摘要 |
A supporting mechanism (12A) is used for transfer-ring a target substrate (W) in cooperation with a transfer arm (32), in a semiconductor processing system. The supporting mechanism includes first and second holding portions (38A to 38C, 40A to 40C) each configured to be moved up and down and transfer a substrate to and from the transfer arm. The first and second holding portions are configured to be moved relative to each other in a vertical direction without spatially interfering with each other, and support substrates at substantially the same horizontal coordinate position. The supporting mechanism further includes first and second drives (46, 48) configured to move the first and second holding portions up and down, and a controller (68) configured to control the first and second drives. The controller is arranged to control the first and second drives to alternatively support a substrate by the first and second holding portions.
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