DIE PACKAGE HAVING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: The bending generation by the difference of the coefficient of thermal expansion it is minimized and the reliability of the die package is improved. CONSTITUTION: The encapsulant layer(108) covers up the side of die. The encapsulant layer is up covered and if the support layer(110) is burned of die. The passivation layer(112) is formed in order to expose pad to the other side of die. The redistribution layer(114) is formed into the state where one end is connected to pad in the passivation layer to be expanded.