MANUFACTURING OF LEAD FRAME FOR ANTI-ROB AND ANTI-SURFACE OXIDATION

摘要

PURPOSE: A manufacturing method of a lead frame and a lead frame thereof are provided to improve the reliability of a wire bonding and prevent surface corrosion of a Copper lead frame by controlling a resin bleed-out phenomenon during a die bonding process. CONSTITUTION: A pattern of a Copper lead frame is formed. The copper lead frame is washed. The inner lead domain of the copper lead frame is silver-plated. A self assembly molecule layer is printed on the surface of the copper lead frame(4). The self assembly molecule is the self assembly monomer of Alkane thiol.