PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A PCB and a manufacturing method thereof are provided to implement high degree of integration of a circuit pattern by forming relatively a thin seed layer when the circuit pattern is formed by using a metal film. CONSTITUTION: An insulating layer is laminated on the surface of an inner layer(S10). A metal layer is attached to the surface of the insulating layer(S20). A via hole is processed in the insulating layer(S30). A carbon plating layer is formed on the inner surface of the via hole and the upper surface of the metal layer(S40). The carbon plating layer is removed by micro-etching the surface of the metal layer(S50). A plating resist is formed on the upper surface of the metal layer(S60). An outer layer circuit is formed on the surface of the metal layer(S70). A part of the metal layer is removed by a flash etching process(S80).