| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which the pressure of a polishing tape is suitably dispersed onto a surface to be polished. SOLUTION: A polishing device 1 imparts tension in a direction intersecting with a main surface Wa of a wafer W, to a predetermined range AR (a range between two guide rollers 13), including a slit 33 in the polishing tape 3 having the slit 33 formed therein. The polishing device 1 polishes an end surface Wb by sliding the polishing tape 3 and the end face Wb of the wafer W, with the tension imparted to the range AR. COPYRIGHT: (C)2011,JPO&INPIT
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