| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of a semiconductor device ensuring flexibility design of a semiconductor element which is higher than that in conventional types, and to provide a method of manufacturing such a semiconductor device, more easily and at lower cost. SOLUTION: The semiconductor device includes a semiconductor element 76, having an upper surface on which a plurality of bonding pads 74 are formed; an insulating sheet 82, bonded to a region other than that where the plurality of the bonding pads of the semiconductor element are formed; a plurality of conductor metal patterns 84 formed on the insulating sheet and electrically connected via each metal wire 92, corresponding to the plurality of the bonding pads on a one-to-one basis; a plurality of conductor posts 94 formed on the insulating sheet and electrically connected with each other, corresponding to the plurality of the conductor metal patterns on the one-to-one basis; and a sealing part 80 for exposing each upper surface of the plurality of the conductor posts and for sealing to cover the upper surface of the semiconductor element, the insulating sheet, the plurality of the conductor metal patterns, each metal wire and portions other than respective upper surface of the plurality of the conductor posts. COPYRIGHT: (C)2011,JPO&INPIT
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