| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspecting apparatus, capable of precisely measuring automatically and analyzing at least the stress and film thickness at a prescribed measuring point in each of all the manufactured semiconductor substrates, so as to contribute to the establishment of a substrate production process of high performance and high productivity. SOLUTION: The inspecting apparatus includes: a conveying device for conveying a wafer to be measured 3 onto a movable specimen support 4; an optical microscope 10 for observing a measuring point P on the surface of the wafer 3 on the specimen support 4; an ellipsometer optical system 40 for irradiating the measuring point P with polarized light L<SB>3</SB>of a multi-wavelength to output information regarding the wafer surface; a Raman spectroscopic optical system 20 for irradiating the measuring point P on the wafer 3 with a laser beam to output other information regarding the wafer 3; and a computer 60 for analyzing and outputting physical information, such as film thickness, refractive index, stress, and composition, on the basis of the pieces of information thus provided. COPYRIGHT: (C)2011,JPO&INPIT |
