PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board for achieving a high-density wire bonding pad, and to provide the structure of a semiconductor device and a method for manufacturing the semiconductor device.

SOLUTION: The printed circuit board includes: an insulating layer 110 composed of an electrical insulating substance; a first circuit layer 130 embedded in one surface of the insulating layer 110 and including a bump pad 131 and a wire bonding pad 133; a second circuit layer 150 formed on the other surface of the insulating layer 110; and a wire-connecting slot 900 pierced into the insulating layer 110.

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