发明名称 PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a pattern which is superior in pattern formability and whose linewidth does not change, after removal of the film. SOLUTION: The pattern forming method includes: a step of forming a pattern forming layer, by arranging a curable composition for imprint containing (A) a polymerizable monomer having a boiling point not less than 250°C at a normal pressure, (B) a photopolymerization initiator and (C) a low-boiling point component, having a boiling point less than 250°C at the normal pressure on a base material; a step of pressure welding a mold on the surface of the pattern-forming layer; and a step of irradiating to the pattern-forming layer with a light. Furthermore, the step of forming the pattern-forming layer includes a step of removing (C) the low-boiling point component, having a boiling point less than 250°C at the normal pressure by heating, and the temperature of the heating is 80°C or below. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010287793(A) 申请公布日期 2010.12.24
申请号 JP20090141585 申请日期 2009.06.12
申请人 FUJIFILM CORP 发明人 KODAMA KUNIHIKO
分类号 H01L21/027;B29C59/02 主分类号 H01L21/027
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