发明名称 LIGHT SIGNAL PROCESSING CIRCUIT, SEMICONDUCTOR DEVICE WITH THE LIGHT SIGNAL PROCESSING CIRCUIT, AND METHOD OF MANUFACTURING THE LIGHT SIGNAL PROCESSING CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device with an optical circuit obtained by flip chip bonding an optical circuit having a waveguide to a semiconductor device, which achieves efficient connection with an optical fiber that performs optical input and output to/from the outside. SOLUTION: The semiconductor device 1 with the light signal processing circuit includes the semiconductor device 2, and the light signal processing circuit 3 connected to the semiconductor device 2 through a connection 4. The light signal processing circuit 3 is constituted of an optical input/output unit 3a housing an end of the optical fiber 20 and allowing entrance and exit of an optical signal, and an optical circuit 3b formed in contact with the optical input/output unit 3a. The optical input/output unit 3a is constituted of base material 5 where a through-hole 5a is bored, and organic resin 12 with which the hole 5a is filled. A convex-lens-like beam shape conversion unit 10 and a positioning unit 11 positioning the optical fiber 20 are formed by molding in the organic resin 12. The optical waveguide 6 of the optical circuit 3b is provided with an optical path changing unit 9 bending light passing through the optical waveguide 6 at a right angle. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010286549(A) 申请公布日期 2010.12.24
申请号 JP20090138364 申请日期 2009.06.09
申请人 NEC CORP 发明人 KINOSHITA MASAO;OHASHI HIROYUKI
分类号 G02B6/30 主分类号 G02B6/30
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