| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device, in which an element can be heated with less energy and moreover, heat transfer to the outside of a package is suppressed. SOLUTION: A piezoelectric device 100 includes a package 10, a piezoelectric element 20 housed inside the package 10, and a heater element 30 housed inside the package 10. The piezoelectric element 20 includes a base 22 and a beam 24 extending from the base 22 and is fixed to the base 22 in a cantilevered or double-supported beam shape; the heater element 30 includes a supporting part 32 and a heat generating part 34 supported by the support part 32 away from the package 10; and the heat-generating part 34 is fixed by the support part 32, in a cantilevered shape or double-supported shape of shape, and the heat generating part 34 and the beam 24 are mutually separated. COPYRIGHT: (C)2011,JPO&INPIT |
