| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a package substrate that avoids waste due to disposal of temporary carrier, in a process for manufacturing a package substrate. SOLUTION: The method for manufacturing a package substrate includes a step for preparing a base material which comprises a release film 20, having two facing surfaces, first auxiliary dielectric layers 21 covering the release film, and metal layers respectively formed on first auxiliary dielectric layers corresponding to the two facing surfaces of the release film, and in which an effective region is set on each metal layer; a step for forming each internal-circuit layer 22 on each metal layer; a step in which a build-up structure 23 is formed on each of first auxiliary dielectric layer and internal-circuit layer, and a plurality of first electrical-contact pads are provided on the outermost layer of each build-up structure, in order to form each basic substrate on the two surfaces of the release film; a step for removing parts other than the effective regions; a step for removing the release film; and a step in which a plurality of dielectric-layer openings are formed on first auxiliary dielectric layer so as to form a basic substrate as a substrate body, and a part of internal-circuit layer is exposed corresponding to each dielectric-layer opening so as to constitute second electrical-contact pads. COPYRIGHT: (C)2011,JPO&INPIT |
