METHOD FOR CUTTING WORKPIECE

摘要

PROBLEM TO BE SOLVED: To provide a method for cutting a workpiece capable of simply and effectively preventing occurrence of warp in cutting a cylindrical workpiece by a wire saw.

SOLUTION: The method for cutting a workpiece into wafers by pressing the cylindrical workpiece against a row of wires formed by winding a wire spirally between a plurality of wire guides and running the wire while supplying slurry to a contact area between the workpiece and the wire includes steps of heating, before cutting, the workpiece to a temperature higher than that of the slurry to be supplied before cutting starts and lower than the highest temperature of the workpiece reached during the cutting of the workpiece, and then cutting the workpiece.

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