| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a board component structure for a winning port device, for excellently securing a yield by effectively utilizing both of an easy-to-plate thermoplastic resin and a hard-to-plate thermosetting resin and contriving an integrated molding process. SOLUTION: A chucker member 120 is molded with a PC resin. Thereafter, a base plate member 110a and a front side housing member 110b are molded from an ABS resin by integrated molding with the chucker member 120 so as to be bonded to the chucker member 120 from the lower side, and then a plating film M is formed on the base plate member 110a. COPYRIGHT: (C)2011,JPO&INPIT
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