ELECTRODE CONNECTION METHOD, ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED FOR THEM, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To form an inexpensive and highly reliable connection structure capable of simplifying a manufacturing process by connecting a connecting electrode having organic films as an oxidation preventing film using a conductive adhesive.

SOLUTION: This electrode connection method for connecting a first connecting electrode 2 to a second connecting electrode 10 through the conductive adhesive 9 interposed between these electrodes includes an organic film forming process to provide an organic film 6 on the surface of at least the first connecting electrode, and an electrode connecting process to connect the first connecting electrode to the second connecting electrode through the conductive adhesive. In the electrode connecting process, an organic film decomposing component blended in the conductive adhesive is made to act on the organic film, and the organic film is decomposed to perform connection between these connecting electrodes.

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