发明名称 CUTTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a two-spindle-type cutting apparatus that achieves reduction in the size and footprint. SOLUTION: The cutting apparatus is surrounded by a frame, having an operation surface cover provided on the operation surface side, on which an operator operates the apparatus; a back-surface cover provided on the side opposite to the operation surface cover; and side-surface covers connecting the operation surface cover and the back surface cover. The cutting apparatus includes a holding table that is provided so as to be capable of moving along a cutting feed path and holds an object to be processed; and first and second cutting means that are provided so as to be capable of moving along an indexing feed path orthogonal to the cutting feed path and cut the object to be processed held by the holding table. The first and second cutting means are provided so as to face each other across the cutting feed path, and the cutting feed path and the indexing feed path are provided so as to be slanted, with respect to the operation surface cover. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010287764(A) 申请公布日期 2010.12.24
申请号 JP20090141040 申请日期 2009.06.12
申请人 DISCO ABRASIVE SYST LTD 发明人 MABASHI TAKAYUKI
分类号 H01L21/301 主分类号 H01L21/301
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