| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer apparatus that applies less stress to a plate-like member, such as a wafer, having brittleness when the plate-like member is an object to be transferred, and that effectively avoids cause of cracking of the wafer. SOLUTION: The transfer apparatus 10 includes a support means 11 disposed on a lower surface side of the semiconductor wafer W to support it, and a moving means 12 of supporting the support means 11 movably. The support means 11 includes a support arm 20 capable of forming a closed loop which is partially opened by a first forming member 24 and second arm forming members 25, and a suction means 21 provided to the support arm 20. Sides of tips 25B of the second arm forming members 25 are provided to contact and leave each other. COPYRIGHT: (C)2011,JPO&INPIT
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