| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate used for a power module which can easily and certainly join a semiconductor element on a circuit layer via a soldering material, a substrate used for a power module with a cooling device, a power module, and to provide a method for manufacturing the substrate used for the power module. <P>SOLUTION: The substrate 10 used for the power module is arranged, in a manner such that a circuit layer 12 made of aluminum or aluminum alloy is located on one surface of an insulating layer 11 and a semiconductor element 3 is located on the circuit layer 12 via a soldering layer 2, and on one surface of the circuit layer 12, an Ag burnt layer 30, made of a burnt body of Ag paste containing glass is formed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
