| 摘要 |
PROBLEM TO BE SOLVED: To effectively utilize a mounting space to increase mounting efficiency by mounting an electronic component constructed as a package having the degree of freedom in a lower space. SOLUTION: In a film package 41 configured by mounting at least one electronic component on a film base material to be mounted on a printed board 2 on which an electronic component is mounted, when it is mounted on the printed board 2, each mounting part is press-bonded on the printed board 2 to stride over the small-sized electronic component 4 mounted on the printed board 2, a first connecting part, an electronic component mounting part, and a second connecting part are bent to have inverted C-shaped cross sections, and each inserting part 46 is bent inward and mounted on the printed board 2 with the first connecting part physically connected with the second connecting part. COPYRIGHT: (C)2011,JPO&INPIT
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