发明名称 POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a power module allowed to be inexpensively manufactured, having an excellent heat releasing property and for preventing electric insulation from being reduced even when a high voltage is applied for a long time under a high-temperature and high-humidity environment. SOLUTION: In the power module including an organic insulating layer 2 between a Cu base substrate 1 and a Cu substrate 4, a Cu migration preventing layer is formed on a surface of the Cu base substrate and/or the Cu substrate to which a positive voltage is applied, which is brought into contact with the organic insulating layer. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010287844(A) 申请公布日期 2010.12.24
申请号 JP20090142403 申请日期 2009.06.15
申请人 MITSUBISHI ELECTRIC CORP 发明人 NISHIMURA TAKASHI;YIN XIAO HONG;HIRAMATSU SEIKI;MIMURA KENJI;YAMAMOTO KEI;MUTO HIROTAKA;SHIODA HIRONORI
分类号 H01L23/36;H01L23/12 主分类号 H01L23/36
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