| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer mechanism by means of a first end effector and a second end effector in an atmospheric transfer portion, in relation to a method of transferring a substrate in a device for treating the substrate. SOLUTION: This device is used for transferring semiconductor substrates from a first location to a second location. The first and second locations are adapted to hold a plurality of semiconductors in individual support area. The device includes a transfer mechanism having two substrate holding end effectors 46, 48 each of which has support areas adapted to individually support different maximum numbers of semiconductors thereon. The semiconductors are transferred from the first location to the second location with use of the first end effector 46 and, when empty individual support areas in the second location or the first location are less than the maximum number of support areas on the first end effector 46, the substrates are transferred from the first location to the second location with use of the second end effector 48. COPYRIGHT: (C)2011,JPO&INPIT
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