| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming solder bumps capable of having a shape made fine and uniformized. SOLUTION: The method of forming solder bumps includes the steps of adhering a self-adhesive film 3 on one surface 2a of a substrate 2 with electrode pads 1, formed thereon to cover the electrode pads 1; radiating laser to the self-adhesive film 3 on the electrode pads 1 to bore bump formation holes 4; printing a solder paste on the self-adhesive film 3 as a printing plate to fill the bump formation holes 4 with the paste; reflowing the substrate adhered with the self-adhesive film 3; and releasing the self-adhesive film 3 from the substrate 2, to form solder bumps 7 on the electrode pads 1. COPYRIGHT: (C)2011,JPO&INPIT
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