| 摘要 |
PROBLEM TO BE SOLVED: To suitably position a substrate with a double structure of layers, even if there is adhesive extrusion or bonding error existing in a notch portion. SOLUTION: An apparatus for positioning the substrate with the double structure obtained by bonding first and second layers includes a position measuring means, including a light emitting means for emitting light to a peripheral edge part of the substrate and measuring a position of a notch portion formed on the same position as the peripheral edge part of the first and second layers, by receiving a light from the light-emitting means; a stage device capable of mounting and moving the substrate; and a control means for controlling the position measuring means and the stage device. The control means decides on the bonding state of the notch portion, based on external data from the position measuring means and further, determines the center position of the notch portion based on the bonded state. COPYRIGHT: (C)2011,JPO&INPIT
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