发明名称 |
SHEET FOR PACKAGING ELECTRONIC PART |
摘要 |
<p>[Problems] Provided is a novel sheet for packaging electronic parts which is excellent in transparency and suitability for thickness reduction. [Means for solving Problems] The sheet for packaging electronic parts is one obtained by biaxially drawing a styrene resin composition comprising 7 to 99.5 mass % of a polystyrene resin (A), 0.5 to 3 mass % of a high-impact polystyrene resin (B) which has a rubber content of 4 to 10 mass %, and 0 to 92.5 mass % styrene-conjugated diene block copolymer (C) wherein the molecular weight of the styrene block part is at least 10,000 and less than 130,000. This sheet has a thickness of 0.1 to 0.7 mm and an orientation release stress value as measured in conformity with ASTM D-1504 of 0.2 to 0.8 MPa.</p> |
申请公布号 |
KR20100135219(A) |
申请公布日期 |
2010.12.24 |
申请号 |
KR20107015414 |
申请日期 |
2008.12.25 |
申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
KAWAUCHI HIROKAZU;KAWATA MASATOSHI;ANDO TAKAYUKI;ARAI YASUHIRO |
分类号 |
C08J5/18;B65D65/38;C08L25/06;C08L53/02 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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