发明名称 |
Integrated circuit device |
摘要 |
An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces (317) being transparent to radiation, and electrically insulative edge surfaces (314) having pads.
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申请公布号 |
US2010323475(A1) |
申请公布日期 |
2010.12.23 |
申请号 |
US20100806787 |
申请日期 |
2010.08.20 |
申请人 |
TESSERA TECHNOLOGIES HUNGARY KFT.. |
发明人 |
BADEHI AVNER |
分类号 |
H01L23/48;H01L23/31;H01L23/485;H01L25/10;H01L27/146;H01L27/15;H01L31/02;H01L31/0203;H01L33/58;H01L33/62 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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