发明名称 |
Graphene wafer, method for manufacturing the graphene wafer, method for releasing a graphene layer, and method for manufacturing a graphene device |
摘要 |
A method is used for releasing a graphene layer from a substrate. A graphene layer is first formed on a surface of a first substrate. A metal layer is then formed on a surface of the graphene layer. A pulling force is then applied to the metal layer to detach the graphene layer from the first substrate. The released graphene layer is bonded by intermolecular force onto a surface of a second substrate separate from the first substrate or onto a surface of a bonding layer formed on the surface of the second substrate. The metal layer is then removed, by for example, etching.
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申请公布号 |
US2010323164(A1) |
申请公布日期 |
2010.12.23 |
申请号 |
US20100801720 |
申请日期 |
2010.06.22 |
申请人 |
OKI DATA CORPORATION |
发明人 |
OGIHARA MITSUHIKO;SAGIMORI TOMOHIKO;SAKUTA MASAAKI;HASHIMOTO AKIHIRO;TANAKA SATORU |
分类号 |
B32B3/26;B32B38/10;C01B31/04 |
主分类号 |
B32B3/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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