| 摘要 |
A high-performance heat dissipation substrate with monoparticle layer, including a surface plate having a first face connected to a heat source and a second face on which a heat dissipation substrate is disposed. The heat dissipation substrate is connectable to an external heat dissipation device. A thermal particle layer is disposed between the surface plate and the heat dissipation substrate in the form of a monoparticle layer. The thermal particle layer includes multiple thermal particles (ceramic materials as diamond, SiC, AIN, Single Crystal Silicon) arranged immediately adjacent to each other and partially inlaid in the surface plate and the heat dissipation substrate. The heat of the heat source can be transferred from the surface plate through the thermal particle layer to the heat dissipation substrate and dissipated outward. |
