| 摘要 |
<p>PURPOSE: A device for analyzing and controlling the particle size of slurry for chemical mechanical polishing for semiconductor manufacture is provided to improve the yield rate of CMP process by controlling the quality of slurry in real time using an inline monitoring system. CONSTITUTION: A device for analyzing and controlling the particle size of slurry for chemical mechanical polishing for semiconductor manufacture comprises a slurry inlet(1), a sample valve(3), a syringe pump, a measuring vessel(7), a sensor and a pump(8). The slurry flows in the slurry inlet. The pump controls the amount of the slurry sample. The slurry sample and diluted solution are mixed in the measuring vessel.</p> |
