| 摘要 |
<p>Provided are a wireless IC device and a method for coupling a power supply circuit and radiating plates, that are capable of coupling the power supply circuit and radiating plates with a high degree of coupling and that enable a reduction in the size of the radiating plates. The wireless IC device is equipped with a wireless IC chip (10), a power supply circuit board (20) that has the power supply circuit comprising inductance elements (L1, L2), and radiating plates (30A, 30B) that have flat coupling sections (31a, 31b). The inductance elements (L1, L2) are formed in a spiral shape, wherein each is coiled in a reverse direction. The flat coupling sections (31a, 31b) of the radiating plates (30A, 30B) are disposed close to the inductance elements (L1, L2) in such a manner as to be roughly orthogonal to the coiling axis thereof, and the power supply circuit is coupled with the radiating plates (30A, 30B) by the generation of an eddy current in the flat coupling sections (31a, 31b). The flat coupling sections may be spiral-shaped.</p> |
