| 摘要 |
The present invention relates to a method for manufacturing a light-emitting diode device, in which a molding unit or a lens unit covering light-emitting diode chips is formed into a non-domed shape by vacuum sealing to achieve a wide variety of light distribution structures. The present invention also relates to a light-emitting diode package and to a light-emitting diode module. More particularly, a method for manufacturing a light-emitting diode device according to one embodiment of the present invention comprises the steps of: preparing a chip assembly having at least one light-emitting diode chip; turning the chip assembly upside down, disposing the chip assembly on an upper mold, and injecting the upper mold into a first vacuum treatment device; injecting a lower mold into a second vacuum treatment device, and filling at least one resin filler unit of the lower mold with a molding resin; injecting the lower mold into the first vacuum treatment device such that the lower mold is located below the upper mold; coupling the upper mold and the lower mold together so as to enable the light-emitting diode chip of the chip assembly to be sealed by the molding resin; hardening the molding resin to form a molding unit with a non-domed shape at the chip assembly; and separating the chip assembly from the upper mold and the lower mold. Particularly, the method further comprises a step of dicing the chip assembly into at least one unit package after the step of separating the chip assembly. |
