APPARATUS FOR WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING
摘要
Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.
申请公布号
WO2010148147(A2)
申请公布日期
2010.12.23
申请号
WO2010US38901
申请日期
2010.06.16
申请人
NOVELLUS SYSTEMS, INC.;MAYER, STEVEN, T.;PORTER, DAVID, W.;WILLEY, MARK, J.;RASH, ROBERT
发明人
MAYER, STEVEN, T.;PORTER, DAVID, W.;WILLEY, MARK, J.;RASH, ROBERT