HIGH-DIELECTRIC-CONSTANT RESIN COMPOSITION, HIGH-DIELECTRIC-CONSTANT RESIN SHEET COMPRISING SAME, AND COPPER FOIL HAVING HIGH-DIELECTRIC-CONSTANT RESIN ATTACHED THERETO

摘要

Disclosed is a high-dielectric-constant resin composition which has a high dielectric constant and a low dielectric tangent, can achieve excellent resin embedding in circuits, and can be used suitably in a layer for insulating between circuits. For producing the resin composition, 250 to 900 parts by mass of a high-dielectric-constant inorganic insulation filler having an average particle diameter (D50) of 0.7 µm or more and a maximum particle diameter of 10 µm or less is blended into 100 parts by mass of a mixed resin (A) which is prepared by mixing a heat-curable polyphenylene ether having a styrene-modified terminal and having a number average molecular weight of 500 to 3000 with a styrene elastomer at a mixing ratio of the heat-curable polyphenylene ether to the styrene elastomer of 60:40 to 80:20 by mass.