| 摘要 |
<p>A surface mounting apparatus and a corresponding surface mounting method for POP packaging devices are provided, wherein, the surface mounting apparatus comprises: a tray (1) mounted on the material rack of the SMT printing machine, a scraper (3) provided above the tray (1), and a steel screen (2) clinging to the surface of the tray (1). The steel screen (2) includes at least one opening, the scraper (3) is provided above the steel screen (2) and clings to the steel screen (2). After the steel screen (2) with the opening is fixed on the tray (1) in the surface mounting apparatus, scraping flux into the opening of the steel screen (2) with the scraper (3) in order to make the thickness of the flux equal to the thickness of the steel screen (2), which can not only accurately control the thickness of the flux in order to form a high quality and stability soldering between upper element and bottom element of the POP packaging devices, but also be easy to operate and highly improve the work efficiency.</p> |
