发明名称 HEAT RADIATING ARRAY
摘要 <p>A heat radiating array includes a leading-in pillar which has an accommodation space; a leading-out pillar which has an accommodation space; at least two heat conducting pipes, whose two ends joint the leading-in pillar and the leading-out pillar so that the accommodation spaces of the leading-in pillar and the leading-out pillar are connected by the heat conducting pipe; the two heat conducting pipes are opposite and a gap is formed between them. The heat radiating array also includes at least one heat radiating block. A first contact surface is set on an outer wall of one side of the heat radiating block, and the heat radiating block has several heat radiating fins connected with the first contact surface. The heat radiating block is set in the gap between the heat conducting pipes. The first contact surface of the heat radiating block contacts an outer wall of a heat conducting pipe, and the ends of the heat radiating fins of the heat radiating block contact an outer wall of another heat conducting pipe. The above structure can improve the efficiency of heat transfer between the heat radiating block and the heat conducting pipe; thereby the heat transfer efficiency of the heat radiating array is improved.</p>
申请公布号 WO2010145100(A1) 申请公布日期 2010.12.23
申请号 WO2009CN73987 申请日期 2009.09.17
申请人 CHIU, KUANYING 发明人 CHIU, KUANYING
分类号 F28D1/03 主分类号 F28D1/03
代理机构 代理人
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